Muhammad Zeeshan Arshad

R&D Software Engineer at Advantest Europe GmbH

Muhammad Zeeshan Arshad's profile photo

About Me

I am a research‑oriented engineer with experience across Automatic Test Equipment, embedded systems, IoT technologies, and signal‑processing platforms. My work focuses on understanding how complex hardware–software systems behave in real conditions, where timing, reliability, and computational efficiency are critical.

I enjoy working where practical engineering meets real world problem solving. I build prototypes, study how systems behave under different conditions, and refine architectures through hands on experimentation and test based developemnt. My experience in embedded and IoT systems has guided my interest in secure, resilient, and high integrity computing, especially in areas where reliability and correctness are essential.

I am currently based in Stuttgart, Germany.

Education

Technical University of Munich (TUM)

M.Sc. Communications Engineering (2016–2018)

NED University of Engineering & Technology

B.E. Electronics Engineering (2012–2016)

Employment

Advantest Europe GmbH — Böblingen, Germany

R&D Software Engineer (February 2025 – Present)

Aquilius Research GmbH — Böblingen, Germany

R&D Software Developer (July 2020 – January 2025)

nextLAP GmbH — Munich, Germany

Embedded Systems Engineer (October 2018 – June 2020)

Master Thesis Engineer (April 2018 - September 2018)

Embedded Systems Intern (November 2017 – Feburary 2018)

Part‑Time R&D Engineer (March 2017 - October 2017)


Technical University of Munich — Applied Laser Spectroscopy Lab

Graduate Assistant (December 2016 – February 2017)


DCC Pvt. Ltd — Karachi, Pakistan

R&D Electronics Engineer (May 2016 - September 2016)


Silicon International Pvt. Ltd — Karachi, Pakistan

Reverse Engineering Intern (May 2014 - June 2014)

Research Interests

Publications

  1. M. Z. Arshad, A. Müller, B. Schmidt, et al.
    A novel heuristic approach to detect induced forming defects using point cloud scans.
    Design Society Proceedings, 2024.
    DOI: 10.1017/pds.2024.75